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| ， Item : Epoxy bond |
| ， Model : SJ-2063 |
| ， FOB Price : Negotiable |
| ， M.O.Q : greater than 100KG per item |
| ， Supply Ability : produced on order |
| ， Payment Terms : 30-day cash on delivery |
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| ∈Product Details |
| - SJ-2063 |
| SJ-2063 is one component resin casting compound, which has been especially developed for the purpose of applying to the encapsulation of CHIP LED. |
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| - Features |
Superior transparent color, excellent moisture resistance, high reliability against heat and shock, resistance to discoloration when operating under high-temperature conditions, outstanding adhesiveness, efficiency of work and economic value of product
Specification: one-component type heat-cured adhesive |
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